REMOTE PADS OR Mentor Xpedition PCB Circuit Design Engineer
Seeking REMOTE PADS OR Mentor Xpedition PCB Design Engineer
US Citizen required / Clearable / No secret clearance
Must Pass Drug Test / Background Check
6 months CONTRACT
Target Pay rate is $65-70/per hour
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Job Description:
Principal REMOTE PCB Layout Designer using PADS OR Mentor Xpedition
Description
We are seeking a Principal PCB Layout Designer using PADS based out of Cincinnati, OH. As a Principal PCB Layout Design Engineer at Northrop Grumman, you will have a challenging and rewarding opportunity to support the design and delivery of high reliability circuit card assemblies for aerospace, defense, and space flight applications. You will collaborate across electrical, mechanical, manufacturing, and signal integrity disciplines to transform complex electrical architectures and schematics into robust, production ready printed circuit board solutions. The successful candidate will be collaborative, open, and team oriented, with a focus on shared responsibility, continuous learning, and a culture of innovation and technical excellence.
For this role, responsibilities include but are not limited to:
Execute the placement and routing of complex, high density, multi layer printed circuit boards (PCBs), including high speed digital, RF, mixed signal, and power circuits
Interpret electrical schematics, constraints, and mechanical boundaries to develop optimized PCB layouts that meet performance, reliability, and manufacturability requirements
Generate and maintain complete PCB and circuit card assembly (CCA) fabrication and assembly documentation packages, including artwork, drawings, fabrication notes, and data outputs for procurement and assembly partners
Apply current IPC and high reliability industry standards, as well as applicable military and aerospace criteria, in the design and verification of printed wiring boards and circuit card assemblies
Collaborate closely with electrical, mechanical, manufacturing, and signal integrity engineers to address layout related design challenges involving signal integrity, power integrity, thermal management, and packaging
Support and perform Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Test (DFT) reviews using automated and manual checks to improve yield, test coverage, and product robustness
Work with fabrication and assembly suppliers to understand manufacturing capabilities and constraints and incorporate them into PCB designs
Support PCB library management practices, ensuring correct use of symbols, footprints, and parameter data in accordance with internal workflows
Independently own PCB layout tasks from concept through fabrication data release in support of program cost, schedule, and technical requirements
Lead advanced PCB layout efforts using technologies such as High Density Interconnect (HDI), microvias, via in pad, backdrilling, and specialized substrate materials; provide technical guidance, peer reviews, and mentoring to other layout designers
Basic Qualifications:
5 Years with Bachelors in Science; 3 Years with Masters; 1 Year with PhD
Willingness and ability to work on site full time at the Cincinnati, OH location
Minimum 5 years of experience performing engineering/layout of printed circuit boards using
PADS OR Mentor Xpedition.
Experience with the layout of PCBs and circuit card assemblies, including placement and routing of high speed digital, RF, and/or mixed signal circuits
Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity
Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations
Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high reliability criteria
Experience generating artwork and PCB/CCA documentation for procurement and assembly houses
Excellent organizational and problem solving skills with a demonstrated ability to adapt effectively to changing requirements
Preferred Qualifications
Prior experience on defense or space flight programs with stringent reliability, documentation, and traceability requirements
Demonstrated experience in the layout of advanced, high density, multi layer printed circuit boards combining RF, high speed digital, and high power circuit sections
Knowledge of PCB process workflows and library management, including creation and governance of symbols, footprints, and reusable layout elements
Ability to translate complex mechanical boundaries and electrical constraints into optimized physical PCB layouts across multiple boards or modules
Knowledge of high reliability military and aerospace hardware criteria (e.g., MIL PRF 31032, MIL STD 883, IPC Class 3/3A), or comparable experience demonstrating equivalent rigor
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***This CONTRACT does NOT include any paid holidays and NO paid vacation days***
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If qualified, APPLY and then call Peggy at 774-210-4108 to discuss.
Job Location: REMOTE, REMOTE
Rate: $65-70/per hour
Per Diem: Possible
Overtime: Possible
Duration: 6+ months CONTRACT
Start Date: 2-3 weeks
Input Date: 10/21/2026
Attention: Peggy Lundie Sr. Recruiter
Address: 15 KENNETH MINER DR
City, State: WRENTHAM, MA 02093
800 Phone: 877/334-7700
Fax Phone: 877/335-7700
Email: plundie@advancedtechno.com
Website: www.advancedtechno.com
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